Preparation and properties of a thermal‑photo dual‑curing acrylic resin tack‑reducing adhesive

SiYuan CHEN, LiFan HE, YaNan HAN, FengJiao WU

Journal of Beijing University of Chemical Technology ›› 2025, Vol. 52 ›› Issue (2) : 34-40.

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Journal of Beijing University of Chemical Technology ›› 2025, Vol. 52 ›› Issue (2) : 34-40. DOI: 10.13543/j.bhxbzr.2025.02.004
Material Science and Engineering

Preparation and properties of a thermal‑photo dual‑curing acrylic resin tack‑reducing adhesive

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 52(2): 34-40 https://doi.org/10.13543/j.bhxbzr.2025.02.004

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