Electroless copper plating assisted by functionalized Ag powder: interface structure and properties

GONG WeiLai, ZHANG Zhen, FANG Bin, ZHU XuMin, YANG XiangMin

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Journal of Beijing University of Chemical Technology ›› 2020, Vol. 47 ›› Issue (4) : 52-59. DOI: 10.13543/j.bhxbzr.2020.04.008

Electroless copper plating assisted by functionalized Ag powder: interface structure and properties

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2020, 47(4): 52-59 https://doi.org/10.13543/j.bhxbzr.2020.04.008

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