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聚合物基复合介电材料的研究进展
Recent developments in polymer-based composite dielectric materials
具有高介电常数、低介电损耗的柔性聚合物基复合材料在电子电气行业和能源等领域有重要的应用前景。本文结合国内外近年来在这一领域的研究成果，对聚合物基高性能复合介电材料的研究进展进行了介绍。根据填料类型的不同，重点讨论了有机填料、介电陶瓷填料和导电填料对聚合物基复合材料介电性能的影响。从填料粒子的结构尺寸、几何形貌，以及填料粒子与聚合物基体之间的界面相互作用出发，探讨了影响复合材料介电性能的因素。在此基础上提出今后的研究要更加关注纳米填料的纳米效应和多组分填料之间的协同作用。
Polymer-based composites with high dielectric constant and low dielectric loss have potential applications in fabricating various electronic and energy storage devices. In this review, recent developments in this area have been summarized with 79 literature references. The effects of different types of fillers, including organic fillers, dielectric ceramic fillers and conductive fillers, on the dielectric properties are first introduced. Then, the effects of other factors—such as filler size, morphology, and the interaction between the filler and the polymer matrix—on the dielectric properties are discussed. We propose that it is worth paying attention to the nanosize effect and the synergy between different types of fillers. In future, greater efforts should be focused on the following targets: (1) the development of novel functional fillers with controlled structures, morphologies and sizes; (2) devising facile composite fabrication processes; (3) developing new technology to enhance the interfacial interaction between the filler and the matrix.
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